Mounting: Heat sink flatness must be less than 50 pm (a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resistance and to reduce the bending stress on the ceramic substrate caused by the temperature difference to the heat sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 t0 0.6 Nm.
TPPM0303 Price| | | | | | | | | | | | |
| ^OAlA2 | ^3 | D0 01 D2 | D3 | D4 D5 | De | D7 | D8 D9 010 | D | D12 013 | 014 | 10 |
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TPPM0303 on stock| Name | Function |
| Vss SDA SCL WP Vcc AO, A1, A2 | Ground Serial Address/Data l/0 Serial Clock Write Protect Input +2.5V t0 5.5V Power Supply No Internal Connection |
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| ltem | Symbol | OOK | ASK | ASK | Units | Notes |
| Nominal NRZ Data Rate | DRNOM | 2.4 | 19 2 | 115.2 | kbps | see page l |
| Minimum Signal Pulse | SPMIN | 416.67 | 52.08 | 8.68 | l_ls | single bit |
| Maximum Signal Pulse | SPMAX | 1666 68 | 208 32 | 34 72 | l_ls | 4 bits of same value |
| TXMOD Resistor | RTXM | 4.7 | 4.7 | 4 7 | K | +5%, for l.5 dBm output |
| DC Bypass Capacitor | CDCB | 4.7 | 4.7 | 4 7 | uF | tantalum |
| RF Bypass Capacitor 1 | CRFB1 | 27 | 27 | 27 | pF | +5% NPO |
| RF Bypass Capacitor 2 | CRFB2 | 100 | 100 | 100 | pF | +5% NPO |
| RF Bypass Bead | LRFB | Fair-Rite | Fair-Rite | Fair-Rite | vendor | 2506033017YO or equivalent |
| Series Tuning Inductor | LAT | 10 | 10 | 10 | nH | 50 0hm antenna |
| Shunt Tuning/ESD Inductor | LESD | 100 | 100 | 100 | nH | 50 0hm antenna |
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