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TPEG24DS-FIR450 Datasheet

Characteristic Symbol 1N 4001/L 1N 4002/L 1N 4003/L 1N 4004/L 1N 4005/L 1N 4006/L 1N 4007/L Unit
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 50 100 200 400 600 800 1000 V
RMS Reverse Voltage VR(RMS) 35 70 140 280 420 560 700 V
Average Rectified Output Current (Note l) @ TA = 75YC 10 1 0 A
Non-Repetitive Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) lFSM 30 A
Forward Voltage @ IF = 1.OA VFM 1 0 V
Peak Reverse Current @ TA = 25IC at Rated DC Blocking Voltage @ TA = 100IC lRM 5 0 50
Typical Junction Capacitance (Note 2) ci 15 8 pF
Typical Thermal Resistance Junction to Ambient ROJA 100 K/W
Maximum DC Blocking Voltage Temperature TA +150 YC
Operating and Storage Temperature Range (Note 3) TSTG -65 to +175 YC


TPEG24DS-FIR450 Price

Value
Characteristics Min Typ Max Units Comments
Supply Current Sleep Powerdown Powerdown - Rx PLL on Powerdown - Tx PLL on Receive Section (l/Q) Receive Section (FM) Receive Section (l/Q) Receive Section (FM) Transmit Section (l/Q) Transmit Section (FM) 20 550 17 17 6 3.5 100 25 26 18.5 19.5 9 6.5 mA mA mA mA mA mA mA mA T = 250C, Vdd = 3V T = 250C, Vdd = 3V
Logic Inputs Input Voltage High - VIH Input Voltage Low - VOL Input Current Input Capacitance 0.8Vdd O2Vdd 1 0 1 0 Volts Volts nA pF Vin=0 to Vdd
Logic Outputs Output Voltage Low Output Voltage High Output Current 0.6Vdd 0.4Vdd +/-1 Volts Volts mA
Serial ControITiming SDATA Set Up ti SDATA Hold t2 SCLK Pulse Width t3 SLATCH Set up t4 SLATCH Pulse Width t5 SCLK Period 20 20 50 20 50 100 t3 - 20 ns ns ns ns ns ns See Fig 7


TPEG24DS-FIR450 on stock
co Build in Biasing Circuit; To reduce using parts cost & PC board space. co High forward transfer admittance; (lyfsl = 42 mS typ. at f= 1 kHz) co Withstanding to ESD; Build in ESD absorbing diode. Withstand up t0 250V at C=200pF, Rs=0 conditions co Provide mini mold packages; MPAK-4R (SOT-143 var.)
The ICS554-01 requires a decoupling capacitor of O.OlyF to be connected between VDD on pin 2 and GND on pin 7, as well as between VDD on pin 15 and GND on pin 10. These decoupling capacitors should be placed as close to the device as possible. A O.Ol LLF capacitor must be placed between the RES (pin 16) and Ground, also, a resistor must be connected between the RES (pin 16) and VDD. Another eight resistors are needed for the PECL outputs as shown on the block diagram on page l. Suggested values of these resistors are shown in the Block Diagram, but they can be varied to change the differential pair output swing, and the DC level. Refer to Application Note, MAN09. To achieve the low output skews that the ICS554-01 is capable of, careful attention must be paid to board layout. Essentially, all 8 0utputs must have identical terminations, identical loads, and identical trace geometries. If they do not, the output skew will be degraded. For example, using a 30Q series termination on one output (with 33Q on the others) will cause at least 15ps of skew.