| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact |
TPEG24DS-FIR450 Datasheet
TPEG24DS-FIR450 Price
TPEG24DS-FIR450 on stock co Build in Biasing Circuit; To reduce using parts cost & PC board space. co High forward transfer admittance; (lyfsl = 42 mS typ. at f= 1 kHz) co Withstanding to ESD; Build in ESD absorbing diode. Withstand up t0 250V at C=200pF, Rs=0 conditions co Provide mini mold packages; MPAK-4R (SOT-143 var.) The ICS554-01 requires a decoupling capacitor of O.OlyF to be connected between VDD on pin 2 and GND on pin 7, as well as between VDD on pin 15 and GND on pin 10. These decoupling capacitors should be placed as close to the device as possible. A O.Ol LLF capacitor must be placed between the RES (pin 16) and Ground, also, a resistor must be connected between the RES (pin 16) and VDD. Another eight resistors are needed for the PECL outputs as shown on the block diagram on page l. Suggested values of these resistors are shown in the Block Diagram, but they can be varied to change the differential pair output swing, and the DC level. Refer to Application Note, MAN09. To achieve the low output skews that the ICS554-01 is capable of, careful attention must be paid to board layout. Essentially, all 8 0utputs must have identical terminations, identical loads, and identical trace geometries. If they do not, the output skew will be degraded. For example, using a 30Q series termination on one output (with 33Q on the others) will cause at least 15ps of skew. |
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