TP12SH9ABE Datasheet The SC16C750B provides 12 internal registers for monitoring and control. These registers are shown in . These twelve registers are similar to those already available in the standard 16C550. These registers function as data holding registers (THR/RHR), interrupt status and control registers (IER/ISR), a FIFO control register (FCR), line status and control registers (LCR/LSR), modem status and control registers (MCR/MSR), programmable data rate (clock) control registers (DLL/DLM), and a user accessible scratchpad register (SPR). Register functions are more fully described in the following paragraphs. TP12SH9ABE Price Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. TP12SH9ABE on stock| T | = 750C | | | | VCE= 10V | | | | 1 | | | | | | | | | 250C | | - | l | | | | | | 2 | )0f | | | | | | | | | | | | | l | | | | | | | | | | 1 | | | | | | | | | | | I | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | |
| Hermetic Meta I Packages = E = /-OP | A- ^__- ^ | T0-254AA 3 LEAD JEDEC T0-254AA HERMETIC METAL PACKAGE ~- | | I | j | | | | | | INCHES | MILLIM ETERS | | | | | 'O | j | < | } | SYMBOL | MIN | MAX | MtN | MAX | NOTES | | | | | H1 | | A | 0.249 | 0.260 | 6.33 | 6.60 | | | f | Lj r | j 1 | I | Ai | 0.040 | 0.050 | 1.02 | 1.27 | | | | | | | Ob | 0.035 | 0.045 | 0.89 | 1.14 | 2,3 | | l | ) | D | O790 | O800 | 20.07 | 20.32 | | | E | 0.535 | 0.545 | 13.59 | 13.84 | | | e | 0.150 TYP | 3.81 TYP | 4 | | | e1 | 0.300 BSC | 7.62 BSC | 4 | | I | | | | | H1 | 0.245 | 0.265 | 6.23 | 6.73 | | | 0.065 R MAX. TYP. | J1 | 0.140 | O160 | 3.56 | 4.06 | 4 | | L | 0.520 | 0.560 | 13.21 | 14.22 | | | -- | e~b | OP | 0 139 | 0.149 | 3.54 | 3.78 | | | JLl'__ZJLO-- | Q | O110 | 0.130 | 2 | 3.30 | | | NOTES: | | I e -- -- Ji ~rP 1. These dimensions are within allowable dimensions of Rev. A at -- ei - JEDEC outline T0-254AA dated 11-86. 2. Add typically 0.002 inches (0.05mm) tor solder coating. 3. Lead dimension (without solder). 4. Position oflead to be measured 0.250 inches (6.35mm) from bot- tom of dimension D. 5. Die to base Beo isolated, terminals to case ceramic isolated. 6. Controlling dimension: Inch. 7. Revision l dated l-93. All Harris Semiconductor products are manufactured, assembled and tested under 1509000 quality systems certification. Harris Semtconductor products are sold by description only. Harris Semiconductor reserves the right to maka changas in circuit design arxVor speolications at any ome withow notlce. Accorcfingly, the raadar is cautioned to vrariN that data sheets ara curranr bebra placing orrkrs. Inlbrmation Nrnished by Harris is believed to be accurate and reliable. Howeuar, no responsibility is assumed by Harrrs or rts substdiarias ibr its uss; nor br any infringaments of patsnts or othsr rights of third parties which may result from rts use. No license is granted by implication or otherwise under any patent or patent rights of Harris or its sub,sicfiaries. Sales Office Headquarters For general information regarding Harris Semiconductor and its products, call l-800-4-HARRIS NORTH AMERICA EUROPE ASIA Harris Semiconductor Harris Semiconductor Harris Semiconductor PTE Ltd. P. O. Box 883, Mail Stop 53-210 Mercure Center No. 1 Tannery Road Melbourne, FL 32902 100, Rue de la Fusee Cencon l, #09-01 TEL: 1-800-442-7747 1130 Brussels, Belgium Singapore 1334 (407) 729-4984 TEL: (32) 2.724.2111 TEL: (65) 748-4200 FAX: (407) 729-5321 FAX: (32) 2.724.22_05 FAX: (65) 748-0400 i HARRIS i - SEMICONDUCTOR I | | | | | | | | | | | | | | | | | | |
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