ADMap-409  > TLP531GB/GR

suppliers of TLP531GB/GR and PDF data of TLP531GB/GR

Part Numbert Mfg Packt D/C Descriptiont Qty Company/Contact  
TLP531GB/GR TOS  DIP-6  08+    1700 
    Theurgy Electronics (Hong Kong..
  • Contact:xie
  • Tel:86-755-82883265
  • Fax:
  • Email: hxyms@theu-int.com


TLP531GB/GR TOS  DIP-6  08+09+  stock  1700 
TLP531GB/GR TOS    07+    DIP-6 
TLP531GB/GR TOS      1391 
    Everchips International Co.,Lt..
  • Contact:Mike
  • Tel:86-21-52683513
  • Fax:
  • Email: sales@everchips.com


TLP531GB/GR TOS  DIP-6  07+  New original packing  1100 
    shenzhen xei shun fa technolo..
  • Contact:dorischen
  • Tel:86-755-23956264
  • Fax:
  • Email: XSFDZ0218@126.COM
TLP531GB/GR TOS    08+  DIP-6   
    Luye (Group) Company Limited
  • Contact:luye
  • Tel:86-755-61390006
  • Fax:86-755-61390086
  • Email: luye@luyeic.com
TLP531GB/GR TOS  DIP-6      1100 
    Shenzhen Ktwell Technology Co...
  • Contact:Zhang
  • Tel:86-755-83653084
  • Fax:
  • Email: ktwellic@gmail.com
TLP531GB/GR TOS  DIP-6  08+    1100 
    LUYE(GROUP) COMPANY LIMITED
  • Contact:adam
  • Tel:86-755-61390003,61390005
  • Fax:86-755-61390086
  • Email: adam@luyeic.com
TLP531GB/GR TOS  DIP-6  08+  New in original pack  1100 
    HK Kejin Electronics Limited ..
  • Contact:Esther Huang
  • Tel:86-755-83997989
  • Fax:86-755-83282993
  • Email: ke-ic@vip.163.com

TLP531GB/GR Datasheet

CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP MAX UNIT
C olleCor Cut-off Current ICBO VCB=240V, IE=O 1O p,A
Emitter Cut-off Current IEBO YEB=7V, IC=O 1.0 p,A
hFE (1) VCE=10V, IC=50mA 40 170
DC Current Gain hFE(2) VCE=10V, IC=lOOmA 20
Collecor-Emier Saturaion Voltage VCE(sat) IC=lOOrnA, IB=20mA 1O V
Base-Emitter Saturation Voltage VBE (sat) IC=lOOmA, IB=20mA 1.2 V
Transition Frequency fT VCE=10V, IC=30rnA 50 MHz
Collecor Output Capacitance Cob VCB=50V, IE=O, f=lMHz 5O pF


TLP531GB/GR Price
The maximum temperature gradient should be less than 50C per second when changing from preheating to soldering. The peak temperature in the soldering process should be at least 300C higher than the melting point of the solder chosen.