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Part Numbert	Mfg	Packt	D/C	Descriptiont	Qty	Company/Contact
SY10EP20VKC	MICREL	MSOP	03+	散新现货	18	All Element Technology co.,ltd Contact:mr Tel:86-755-82565936 Fax::+86-755-82565338 Email: sales@allelement.net

SY10EP20VKC Datasheet


- D=1 = D:0 5
- D:0 2	'

- D:0 02 n:n ni		rc:2siC 0Ih(ch c) (t):r(t) .0Ih(ch c)

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Notes: l. SeL COUT Lo be 47 pF or greater and select it according to Lhe applications 2. Use Lhe capacilators for COUT and Cd with high-temperature stability.
SY10EP20VKC on stock

In the event of a major short circuit condition, the device also includes a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops about 15 degrees. If the contention persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown.

Parameter	Symbol	Values	Unit
Continuous drain current Tc = 31 aC	D	7.5	A
Pulsed drain current Tc = 25 0C	D puls	30
Avalanche current,limited by Tjmax	/AR	7.5
Avalanche energy,periodic limited by Tjmax	EAR	1 6	mJ
Avalanche energy, single pulse /D = 7.5 A, VDD = 50 V, RGS = 25 L = 27.7 mH, Tj = 25 aC	EAS	830	mJ
Gate source voltage	VGS	±20	V
Power dissipation Tc = 25 aC	Ptot	1 50	W
Operating temperature	Tj	-55+150	aC
Storage temperature	Tstg	-55+150	aC
Thermal resistance, chip case	RthjC	0.83	K/W
Thermal resistance, chip to ambient	RthjA	75	K/W
DIN humidity category, DIN 40 040		E
IEC climatic category, DIN IEC 68-1		55 /15056

In using surface mount devices such as the T0-252 package, the environment in which it is applied will have a significant influence on the part's current and maximum power dissipation ratings. Precise determination of PDM iS complex and influenced by many factors:

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