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STPS70N03L Datasheet

RATING	SYMBOL	SBT 20	SBT 30	SBT 40	SBT 50	SBT 60	SBT 70	SBT 80	SBT 90	SB TBO	UNIT
Maximum Recurrent Peak Reverse Voltage	VRRM	20	30	40	50	60	70	80	90	100	Volts
Maximum RMS Voltage	VRMS	14	21	28	35	42	49	56	63	70	Volts
Maximum DC Blocking Voltage	VDC	20	30	40	50	60	70	80	90	100	Volts
Maximum Average Forward Current 0.375", 9.5mm Lead Length See Fig.l	IF(AV)	2.5									Amps
Peak Forward Surge Current, 8.3ms single half sine wave superimposed on rated load (JEDEC Method)	IFSM	75									Amps
Maximum Forward Voltage at IF = 2.5 Amps. (Note l)	VF	0.5			0.74			0.79			Volt
Maximum Reverse Current at Rated DC Blocking Voltage (Note l)	IR	0.5									mA
Junction Temperature Range	TJ	- 65 to+ 125			- 65 to+ 150						oC
Storage Temperature Range	TSTG	- 65 to+ 150									oC

STPS70N03L Price

		7C199-20		7C199-25		7C199-35		7C199-45
Parameter	Description	Min	Max	Min	Max	Min	Max	Min	Max	Unit
Read Cycle
tRC	Read Cycle Time	20		25		35		45		ns
tAA	Address to Data Valid		20		25		35		45	ns
tOHA	Data Hold from Address Change	3		3		3		3		ns
tACE	CE LOW to Data Valid		20		25		35		45	ns
tDOE	OE LOW to Data Valid		9		10		16		16	ns
tLZOE	OE LOW to Low_2[8l	0		0		0		0		ns
tHZOE	OE HIGH to High-2[8, 9l		9		11		15		15	ns
tLZCE	CE LOW to Low_2[8]	3		3		3		3		ns
tHZCE	CE HIGH to High-2[8, 9l		9		11		15		15	ns
tPU	CE LOW to Power-up	0		0		0		0		ns

STPS70N03L on stock

(1) Low power-loss(Dropout voltage: MAX 0.5V at Io=2.OA) (2) 2.OA output type (3) Compact resin full-mold package(equivalent to T0-220) (4) Available 3.3V/5V/9V/12V output type (5) Output voltage precision: +3.0% (6) Built-in ON/OFF control function (7) Overcurrent, overheat protection functions (8) Lead forming type is also available.

(c) Repetitive rating - pulse width limited by max junction temperature. refer to Transient Thermal Impedance graph. td; For a single device surface mounted on 10sq cmloz copper on FR4 PCB in still air conditions with minimal lead connections only. tel For a single device surface mounted on 65sq cm20z copper on FR4 PCB in still air conditions with all exposed pads attached. (f; The minimum copper dimensions required for mountmg are no smaller than the exposed metal pads on the base of the device, as shown in the package dimensions data. The thermal resistance for a device mounted on l.5mm thick FR4 board using minimum copper of loz weight is Rth=3000C/W giving a power rating of Ptot=420mW.

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