| | ltem | Specification | Criteria |
| | | | Soldered chi below drawir | p on PC board is to be bent down t0 2mm as ig |
| o | Bending test | No apparent damage | ,20 \l \ | >Weht a 7 ^ | 1 2 1 0 0 8 | LL2012 LL1608 LL1005, LLP1005, LLV0603 |
| 2 0 | LL2012, LL1608 |
| o -C | f | ; -/I\ nl I 45 -r | 1 5 | LL1005, LLP1005 LLV0603 unit : mm |
| o .LJ C | Vibration test | No apparent damage L : within +10% O: within +20% | Apply frequency 10~55Hz, 1.5mm amplitude for each perpendiculer direction of 2 hours. |
| -C o o | Resistance to soldering heat | No apparent damage Terminal extant % : more than 90% | Pre-heat at 1600C, 2~3 minutes. Soak into the molten solder bath of 260+50C at 10+0.5 seconds. |
| Solderability test | No apparent damage Terminal surface wet % : more than 90% | Pre-heat at 1600C, 2~3 minutes. Soak into the molten solder bath of 230+50C at 4+1 seconds. |
| | Humidity test | No apparent damage L : within +10% O: within +20% | Exposure at 600C, 95% RH for 1000 hours. Characteristics are measured after the ambient air exposure of 2 hours. |
| = o o | Dry Heat test | No apparent damage L : within +10% Q: within +20% | Exposure at lOOoC, for 1000 hours. Characteristics are measured after the ambient air exposure of 2 hours. |
| - o | Cold test | No apparent damage L : within +10% Q: within +20% | Exposure at -400C, for 1000 hours. Characteristics are measured after the ambient air exposure of 2 hours. |
| n) E LU | Temperature cycling test | No apparent damage L : within +10% O: within +20% | Solder the sample on PC board. 100 cycles of +lOOoC for 30 minutes, -400C for 30 minutes. Characteristics are measured after the ambient air exposure of 2 hours. |
| Temperature coefficient | L : within +10% (Typical: +250 ppm/oC) | Monitor L change throughout temperature of -400C to +lOOoC with reference to L at 200C. |
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