| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| STK5164GHI35 | DIP-40 | 08+/09+ | 全新原装，欢迎订购！ | 20 |
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STK5164GHI35 Datasheet
STK5164GHI35 Price Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are Infrared (IR) Reflow, Vapour Phase Reflow, and Wave Soldering. Typical profiles are shown in Figures 12, 13 and 14. When wave soldering, the MLN suppressor is attached to the circuit board by means of an adhesive. The assembly is then placed on a con- veyor and run through the soldering process to contact the wave. With IR and Vapour Phase Reflow, the device is placed in a solder paste on the substrate. As the solder paste is heated, it reflows and solders the unit to the board. The negative input (FB) is tied to the output sense location with a resistor, RB, and is used for sensing and controlling the output voltage at this point. A current source from the FB pin flowing through RB is used for setting the no-load offset voltage from the VID voltage. The no-load voltage will be positive with respect to the VID DAC. The main loop compensation is incorporated in the feedback network between FB and COMP. |
