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STK-457 Datasheet
Mounting Instructions 1. NOTE: For broadband RF unconditional stability do not put GND vias under the exposed backside GND paddle 2. Solder the copper pad on the backside of the device package to the ground plane. 3. Use a large ground pad area with many plated through-holes as shown. 4. We recommend l or 2 0unce copper. Measurement for this data sheet were made on a 31 mil thick FR-4 board with l ounce copper on both sides.
STK-457 Price

PARAMETER bYMBOL MIN MAX UNITS
Supply Voltage Vcc 4.5 5.5 V
Input Voltage VIL -0.31 0.8 V
VIH 2.2 Vcc +12
Thermal Impedance - DIP Package OJC 1126 o c/w
Thermal Impedance - Flat Package OJC 1127 o c/w
Operating Temperature Range TOPR -55 +125 C


STK-457 on stock
It may be desirable in some applications (due to noise or other considerations) to increase or decease the oscillator frequency. This can be achieved by overdriving the oscilla- tor from an external clock, as shown in Figure 6. In order to prevent possible device latch-up, a lkl resistor must be used in series with the clock output. In a situation where the designer has generated the external clock frequency using TTLlogic,the addition ofa 10kl pull-up resistor to V+supply is required. Note that the pump frequency with external clocking, as with internal clocking, will be l/2 0f the clock frequency. Output transitions occur on the positive-going edge of the clock.
. On-Chip PLL Provides Clock Synthesis From Low-Speed Reference . Receiver Differentiallnput Thresholds 200 mV Min . Rated for Industrial Temperature Range . Typical Power: 1700 mW at 2.5 Gbps . Idealfor High-Speed Backplane Interconnect and Point-to-Point Data Link . Internal Passive Receive Equalization . Small Footprint 19 mm x 19 mm, 289-Ball PBGA Package