| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| SKIIP72GB12 | ?西门康 | 2008 | NEW IN STOCK | 158 |
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SKIIP72GB12 Datasheet
SKIIP72GB12 Price The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published :oy Mitsu:oishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.mitsu:oishichips.com) . SKIIP72GB12 on stock (2) Soldering Optical modules are comprised ofinternal semiconductor devices. However, in principle, optical modules are optical components. During soldering, ensure that flux does not contact with the emitting surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering. Some optical modules come with a protective cap. The protective cap is used to avoid malfunction when the optical module is not in use. Note that it is not dust or waterproof. As mentioned before, optical modules are optical components. Thus, in principle, soldering where there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend that soldering be performed without the optical module mounted on the board. Then, after the board has been cleaned, the optical module should be soldered on to the board manually. If the optical module cannot be soldered manually, use non-halogen (chlorine-free) flux and make sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of flux. In such a cases, be sure to check the devices' reliability.
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