| Electrical Characteristics TA = 250C unless otherwise noted |
| | Symbol | Parameter | Test Conditions | Min | Typ | Max | Units | |
| Off Characteristics |
| BVDSS | Drain-Source Breakdown Voltage | VGS = 0 V, ID = -250 yA | -40 | | | V |
| ABVDSS ATj | Breakdown Voltage Temperature Coefficient | ID = -250 UA, Referenced t0 250C | | -32 | | mVIoC |
| IDSS | Zero Gate Voltage Drain Current | VDS = -32 V, VGS = 0 V | | | -1 | UA |
| IGSS | Gate-Body Leakage | Vcs = +10 v VDS = OV | | | ±100 | nA |
| On Characteristics (Note 2) |
| VGS(th) | Gate Threshold Voltage | VDS = VGS, ID = -250 yA | -1 | -1.6 | -3 | V |
| AVGsctn) ATj | Gate Threshold Voltage Temperature Coefficient | ID = -250 UA, Referenced t0 250C | | 4.7 | | mVIoC |
| RDS(on) | Static Drain-Source On-Resistance | VGS = -10 V, ID = -8.2 A VGS = -4.5 V, ID = -7 A VGS = -10 V, ID = -8.2 A, Tj = 1250C | | 22 29 31 | 27 35 42 | mQ |
| gFS | Forward Transconductance | VDS = -5 V, ID = -8.2 A | | 22 | | S |
| Dynamic Characteristics |
| Ciss | Input Capacitance | VDS = -20 V, VGS = 0 V, | | 1872 | | pF |
| Coss | Output Capacitance | f = 1.0 MHz | | 256 | | pF |
| Crss | Reverse Transfer Capacitance | | 134 | | pF |
| RG | Gate Resistance | VGS = 15 mV, f = 1MHz | | 4 | | Q |
| Switching Characteristics (Note 2) |
| td(on) | Turn-On Delay Time | VDD = -20 V, ID = -1 A, | | 14 | 25 | ns |
| tr | Turn-On Rise Time | VGS = -10 V RGEN = 6Q | | 11 | 20 | ns |
| td(off) | Turn-Oft Delay Time | | 50 | 80 | ns |
| tf | Turn-Off Fall Time | | 18 | 32 | ns |
| Qg | Total Gate Charge | VDS = -20 V, ID = -8.2 A, | | 19 | 27 | nC |
| Qgs | Gate-Source Charge | VGS = -5 V | | 5.6 | | nC |
| Qgd | Gate-Drain Charge | | 6.1 | | nC |
| Drain-Source Diode Characteristics |
| VSD | Drain-Source Diode Forward Voltage | VGS = 0 V, IS = -2.1 A (Note 2) | | -0.7 | -1.2 | V |
| t | Diode Reverse Recovery Time | IF = -8.2 A, | | 26 | | nS |
| Q rr | Diode Reverse Recovery Charge | diF/dt = 100 A/ps | | 15 | | nC |
| Notes: 1. RejA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RejC is guaranteed by design while ReCA is determined by the user's board design.. V when mounted 150/W when mounted ) 1250/W when mounted ~7P a) 500C/Wonga l in' pad of 2 0z ~L< )J}d b) 1050M on aL.04Pin' pad1of 2 0z ] 6 ( on a minimum pad. |
| | copper ::paper |
| Scale l :1 0n letter size paper 2. Pulse Test: Pulse Width < 300Us, Duty Cycle < 2.0% |
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