ADMap-9  > SKB15-08A2

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SKB15-08A2 Datasheet

Codeco test Codecl test Audio left DAC and ADC test mode (manufacturing test purpose) Audio right DAC and ADC test mode (manufacturing test purpose) 3
3. This pin should be low for normal operation. It is used only in manufacturing test
4. PIN of MEMA[19:0] : A6, B7, A7, C7, D7, B8, A8, D8, A9, C8, D9, Al0, B9, C9, Bl0, All, A12, Bll, B12, Cll 5. PIN of MEMD [15:0] : Fll, F12, Gll, G12, H12, Gl0, Hll, Hl0, J12, K12, J9, Jll, Jl0, L12, Kl l, Kl0 6. In non byte access device such as flash memory(x16), these pin will be not connected
7. This pin can be programmed to access the second NAND flash chip in addition to SM_CSB signal. With this pin, PT8R1202 can support up t0 4 Gb(512MB) NAND flash directly. 8. These pins can be used as multiple purposes by programming such as digital AMP output, UART flow control signal and alternative I2S input. From R2.4, the default direction and signal usage is changed. The default configuration is the output ofinternal digital amplifier. For the case ofalternative I2S input mode, the sampling frequency ofI2S input can be different to that ofI2S output. 9. Intemal audio codec is not recommended to use for both voice and audio. Instead ofinternal stereo sigma-delta DAC, we recommend to use external voice and audio codec. From R2.6, EARA and EARB PAD are only dedicated to oscillator PAD for extemal sleep crystal.


SKB15-08A2 Price
Fully optimized differential digital gear tooth sensor Single chip sensing lC for high reliability Internal current regulator for 2 wire operation Small mechanical size (8 mm dia x 5.5 mm length) Air gap independent switch points Digital output representing gear profile Precise duty cycle signal with temperature Large operating air gaps Automatic Gain Control (AGC) Automatic Offset Adjustment circuit True zero speed operation Under-voltage lockout Wide operating voltage range Defined power-on state
SKB15-08A2 on stock

PARAMETER 3UBGROUPS SYMBOL MINI TYP MAX UNITS
WE Pulse Width -120 -150 CE Pulse Width -120 -150 9. 10, 11 tWp 2 tCW 3 200 250 200 250 ns
Address Hold Time -120 -150 9. 10, 11 tAH 150 150 ns
Data Setup Time -120 -150 9. 10, 11 tDS 75 100 ns
Data Hold Time -120 -150 9. 10, 11 tDH 10 10 ns
Chip Enable Hold Time2 -120 -150 9. 10, 11 tCH O O ns
Output Enable to Write Setup Time -120 -150 9. 10, 11 tOES O O ns
Output Enable Hold Time -120 -150 9. 10, 11 tOEH O O ns
Data Latch Time4 -120 -150 9. 10, 11 lDL 230 280 ns
Write Cycle Time -120 -150 9. 10, 11 twc 10 10 ms
Byte Load Window4 -120 -150 9. 10, 11 lBL 100 100 us
Byte Load Cycle4 -120 -150 9. 10, 11 tBLC O55 0.55 30 30 us
Write Start Time -120 -150 9. 10, 11 tDW 150 150 ns


^J_|i m c:]nB:l..l~l.iI1NIN [~ _ LIMIT PARAMFER SYMBOL
-40 to +850C Operating & Storage Temperature ST-2A (Note l) Tstg, Top
Note l: Temperature range can be extended to -550 to +1250C on request -¨-K1R