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SK470M016C070 Datasheet

VINTVCC INTVcc Regulator Output Voltage VIN= 7.5V 5.0 5.2 5.4 V
CVINTVCC CVIN1 INTVcc Regulator Line Regulation 7.5V " VIN " 15V 8 25 mV
CVINTVCC IN2 INTVcc Regulator Line Regulation 15V " VIN " 30V 70 200 mV
VLDO(LOAD) INTVcc Load Regulation 0 " IINTVCC " 20mA -2 - 0.2 %
VDROPOUT INTVcc Regulator Dropout Voltage VIN = 5V, INTVcc Load = 20mA 280 mV
IlNTVCC Bootstrap Mode INTVcc Supply Current in Shutdown RUN = OV, SENSE = 5V 10 20 A


SK470M016C070 Price

Part number Cycle Time ns Clock Frequency MHz Organization (word x bit) Core Supply Voltage V I/O Interface Package
,uPD44324084F5-E33-EQ2 Note 3 3 300 4M X 8-bit 1.8±0.1 HSTL 165-pin PLASTIC
,uPD44324084F5-E40-EQ2 4.0 250 FBGA (13 x 15)
,uPD44324084F5-E50-EQ2 5.0 200
,uPD44324094F5-E33-EQ2 Note 3 3 300 4M X 9-bit
,uPD44324094F5-E40-EQ2 4.0 250
pPD44324094F5-E50-EQ2 5.0 200
,uPD44324184F5-E33-EQ2 Note 3 3 300 2 M X 18-bit
,uPD44324184F5-E40-EQ2 4.0 250
,uPD44324184F5-E50-EQ2 5.0 200
,uPD44324364F5-E33-EQ2 Note 3 3 300 1M X 36-bit
pPD44324364F5-E40-EQ2 4.0 250
,uPD44324364F5-E50-EQ2 5.0 200


SK470M016C070 on stock
(2) Storage . Storage Conditions Before opening the package : The LEDs should be kept at 300C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 300C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. Ifunused LEDs remain, they should be stored in moisture proofpackages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proofbag and to reseal the moisture proofbag again. . If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 + 50C . Nichia LED electrode and leadframe are comprised of a silver plated copper alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower solderability or might affect on optical characteristics. . Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur.

Dig7 SegA Dig6 SegB Dig5 SegC Dig4 SegD Dig3 SegE Dig2 SegF Digl SegG Digo SegH SDA VCC SCL OSC2 /rNT osci GND /RES