| Symbol | Parameter | Value | Unit |
| RtriO_c) | Maximum Junction-case Thermal Resistance MINIDIP | 50 | IC/W |
| RthO_a) | Maximum Junction-ambient Thermal Resistance MINIDIP | 120 | YC/W |
| | Junction-ceramic Substrate (case glued to substrate) S014 | 90 | YC/W |
| | | |
(4) The products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). Consult our sales staffin advance for information on the following applications: ~ Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ~ Any applications other than the standard applications intended.
