For optimum electrical and thermal performance, the driver should be soldered directly into the board. The driver supply terminal, VBB, should be decoupled with an electrolytic capacitor placed as close to the device as possible. To avoid problems due to capacitive coupling of the high dv/dt switching transients, route the high-level, output traces away from the sensitive, low-levellogic traces. Always drive the logic inputs with a low source impedance to increase noise immunity. Grounding. A star ground system located close to the driver is recommended. The logic supply return and the driver supply return should be connected together at only a single point - the star ground. Logic supply voltage, VDD. Transients at this terminal should be held to less than 0.5 V to avoid malfunctioning operation. Both VBB and VDD may be turned on or off separately.
RR0816P-3922-B-T5-58C Price Due to the size ofthe package, Micron's standard part number is not printed on the top of each device. Instead, an abbreviated device mark comprised of a five-digit alphanumeric code is used. The abbreviated device marks are cross referenced to the Micron part numbers in Table l.
RR0816P-3922-B-T5-58C on stock| | | |
| Line card Vbat T |
| Rs(*) l | | |
| ( Line ( | I TIP : GND 220nF _I_ :, LGP02 i~- | TIP |
| 7 l l j j Rs() | 220nF | SLIC |
| ( | L___________J I | RING |
| _L +Vb |
| Rs f+1 = PTC or Resistor fuse |
| | | | | |
| Symbol | Parameter | Max Value | Unit |
| IAR | Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max, 8 < 1%) | 55 | A |
| EAS | Single Pulse Avalanche Energy (starting Tj = 25 0C, ID = IAR, VDD = 25 V) | 200 | mJ |
| | | |
