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QRW035AOF41 Datasheet 1. The printed wiring board should use a heavy ground plane. A two-sided board with ground planes on both sides of the board is most desirable. Several copper vias under the device can be used to connect the ground planes and enhance thermal performance. 2. For optimum electrical and thermal performance, the device should be soldered directly onto the board. 3. Keep the sense resistor traces as short and as wide as possible to lower trace resistance. 4. Connect the bypass capacitors as close to the device as possible. The lower value ceramic capaci- tors should be closer to the device than the electrolytics. The supply voltage, VIN, should be decoupled with an electrolytic capacitor placed as close to the device as possible. QRW035AOF41 Price First, the power dissipation in the resistor should be considered. The system load current will cause both heat and voltage loss in RSENSE As a result, the sense resistor should be as small as possible while still providing the input dynamic range required by the measurement. Note that input dynamic range is the difference between the maximum input signaland the minimum accurately repro- duced signal, and is limited primarily by input DC offset of the internal amplifier of the LTC61 01. In addition, RSENSE must be small enough that VSENSE does not exceed the maximum input voltage specified by the LTC6101, even under peakload conditions. As an example, an application may require that the maximum sense voltage be lOOmV. If this application is expected to draw 2A at peak load, RSENSE should be no more than 50mQ. QRW035AOF41 on stock
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