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QM40-14P-PR1 Datasheet

Notes: [5] Capacitance is sample tested only. [6] Only one output at a time. Duration should not exceed 30 seconds. [7] For commercial grade devices only. Maximum ICC is 5 mA for allindustrial grade devices. For AC conditions, contact QuickLogic customer engineering.
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Parameters	Test Conditions	Symbol	Min	Typ	Max	Unit l
Supply current	Power down, VENABLE < 0.25 V, -400 C t0 850C VPA-ENABLE < 0.25 V, -400C to +1250 C VPA-ENABLE < 0.25 V, 25aC (100% correlation tested)	IS_Off		<10	350 7
Supply current	Power up, PA off, Vs = 3 V, VENABLE > 1.7 V, VPA-ENABLE < 0.25 V	Is		3.7	4.8	mA
Supply current	Power up, Vs = 3.0 V, VENABLE > 1.7 V, VPA-ENABLE > 1.7 V	IS_Transmit		9	11.6	mA
Output power	Vs = 3.0 V, Tamb = 250 C, f = 315 MHz, ZLoad = (255 +j192) W	PRef	6.0	8.0	10.5	dBm
Output power variation for the full temperature range	Tamb = -400 C to +850 C, Vs = 3.0 V Vs = 2.0 V	APRef APRef			1_5 -4.0
Output power variation for the full temperature range	Tamb = -400C to +1250C, Vs = 3.0 V Vs = 2.0 V, POut = PRef + APRef	APRef APRef			-2.0 -4.5
Achievable output-power range	Selectable by load impedance	POut_typ	0		8.0	dBm
Spurious emission	fCLK = fo/128 Load capacitance at Pin CLK = 10 pF fo +1 x fCLK fo +4 x fCLK other spurious are lower			-55 -52
Oscillator frequency XTO (= phase comparator frequency)	fXTO = fo/32 fXTAL = resonant frequency of the XTAL, CM i10 fF, load capacitance selected accordingly Tamb = -400 C to +850 C, Tamb = -400 C to +1250 C	fXTO	-30 -40	fXTAL	+30 +40
PLL loop bandwidth				250		kHz
Phase noise of phase comparator	Referred to fPC = fXTO, 25 kHz distance to carrier			-116	-110	dBc
In loop phase noise PLL	25 kHz distance to carrier			-86	-80	dBc/Hz
Phase noise VCO	at l MHz at 36 MHz			-94 -125	-90 -121	dBc/Hz dBc/Hz
Frequency range of VCO		fvco	310		330	MHz
Clock output frequency (CMOS microcontroller compatible)				fo/1 28		MHz
Voltage swing at Pin CLK	CLoad i10 pF	VOh Vol	Vs×0.8		Vs×0.2
Series resonance R of the crystal		Rs			1 10	Q
Capacitive load at Pin XTO					7	pF

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NOTES FOR STABLE AND SAFE OPERATION ; ~ Design the PCB pattern to minimize wiring length between opto-coupler and IPM's input terminal, and also to minimize the stray capacity between the input and output wirings of opto-coupler. *Quick opto-couplers: TPLH, TPLH < 0.8Us. Use High CMR type. The line between opto-coupler and intelligent module should be shortened as much as possible to minimize the floating capacitance. ,Slow switching opto-coupler: recommend to use at CTR = 100 ~ 200%, Input current = 8 ~ lOmA, to work in active. *Use 4 isolated control power supplies (VD). Also, care should be taken to minimize the instantaneous voltage charge of the power supply. ,Make inductance of DC bus line as small as possible. and minimize surge voltage using snubber capacitor between P and N terminal. * Use line noise filter capacitor (ex. 4.7nF) between each input AC line and ground to reject common-mode noise from AC line and improve noise immunity of the system.

Notes (al For a dual device surface mounted on 8 sq cm single sided 20z copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (b; Measured at t<5 secs for a dual device surface mounted on 8 sq cm single sided 20z copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (c) For a dual device surface mounted on 8 sq cm single sided 20z copper on FR4 PCB, in still air conditions with minimal lead connections only. tdl For a dual device surface mounted on 10 sq cm single sided loz copper on FR4 PCB, in still air conditions with all exposed pads attached attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (el For a dual device surface mounted on 85 sq cm single sided 20z copper on FR4 PCB, in still air conditions with all exposed pads attached attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (fl For a dual device with one active die. (gl For dual device with 2 active die running at equal power. (hj Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph. (il The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the package dimensions data. The thermal resistance for a dual device mounted on l.5mm thick FR4 board using minimum copper l oz weight, Imm wide tracks and one half of the device active is Rth = 2500C/W giving a power rating of Ptot = 400mW.

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