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QM30-8PL-EP Datasheet

Characteristic	Symbol	Max	Unit
Forward Current	IF	75	mA
Reverse Voltage	VR	60	V
Power Dissipation	PD	130.00	mW
Operating Temperature	Topr	-25+80	c
Storage Temperature	Tstg	-25+120	c
Soldering Temperature	Tsol	250	c
Soldering Time		for 10 sec. max

QM30-8PL-EP Price

Features q Especially suitable for applications from 400 nm t0 1100 nm q Short switching time (typ. 20 ns) q DIL plastic package with high packing density q BPW 34 S/(E9087): suitable for vapor-phase and IR-reflow soldering (JEDEC level 4)
QM30-8PL-EP on stock

A	B	C	D
	x
Date		Approved
1.Mar.'02		H.Kiyosue

. All the terminals and the mounting plate are electrically isolated. These modules can be installed in the same cooling fin as other modules, thus saving installation space -a cost-effective feature. . The diode chips are coated with a glass of zinc oxide, making them highly resistant to temperature and humid- ity variation. . 6 diode chips are connected to the 3-phase bridge rectifying circuit inside the module-a cost-effective fea- ture.

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