| Parameter | Test condition | Symbol | DFL 15005S | DFL 150lS | DFL 1502S | DFL 1504S | DFL 1506S | DFL 1508S | DFL 1510S | DFL 1514S | Unit |
| Max. instantaneous forward voltage drop per leg | at l.5A | VF | 1.1 | V |
| Maximum DC reverse current at rated DC blocking voltage per leg | TA = 25 0C TA = 125 0C | IR | 5.0 500 | UA |
| Typical junction capacitance per leg (1) | | cJ | 16 | pF |
| | | | | | | | | | | |
For surface mount devices heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. Experiments have shown that the heat spreading copper layer does not need to be electri- cally connected to the tab of the device. The PC material can be very effective at transmitting heat between the pad area, attached to the tab of the device, and a ground or power plane layer either inside or on the opposite side of the board.Although the actualthermal resistance ofthe PC material is high, the length/area ratio of the thermal resistor between layers is small. Copper board stiffeners and plated through-holes can also be used to spread the heat generated by power devices.
