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PC16550CN PC16550CN PC16550CN Datasheet

Parameter	Symbol	Limits	Unit
] l/7-	VCBO	-80	V
]L·-	VCEO	-80	V
	VEBO	-5	v
]L	Ic	-7	A
]L	Ic	-10	A (Pulse)
]L	Pc	40	W (Tc=25c)
	Tj	150	c
	Tstg	-55150	c

PC16550CN PC16550CN PC16550CN Price

Mechanical stress performance is a greater considera- tion for a UCSP package. UCSPs are attached through direct solder contact to the user's PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be consid- ered. Information on Maxim's qualification plan, test data, and recommendations are detailed in the UCSP application note, which can be found on Maxim's web- site at www.maxim-ic.com.
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