| DC Electrical Specifications (Continued) |
| | | | TE COND | ST TIONS | | 250C | .400C T0 850C | .55aC T0 1250C | | |
| PARAMETER | SYMBOL | vI (V) | la (mA) | vcc (v) | MIN | TYP | MAX | MIN | MAX | MIN | MAX | UNITS |
| Three-State Leakage Current | 102 | VIL or VIH | | 6 | | | +0.5 | | +0.5 | | +10 | o:A |
| HCT TYPES |
| High Level Input Voltage | VIH | | | 4.5 to 5 5 | 2 | | | 2 | | 2 | | V |
| Low Level Input Voltage | VIL | | | 4.5 to 5 5 | | | 0 8 | | 0.8 | | 0.8 | V |
| High Level Output Voltage CMOS Loads | VOH | VIH or VIL | -0.02 | 4 5 | 4 4 | | | 4.4 | | 4.4 | | V |
| High Level Output Voltage TTL Loads | 6 | 4 5 | 3 98 | | | 3 84 | | 3.7 | | V |
| Low Level Output Voltage CMOS Loads | VOL | VIH or VIL | 0.02 | 4 5 | | | 0 1 | | 0.1 | | 0.1 | V |
| Low Level Output Voltage TTL Loads | 6 | 4 5 | | | 0 26 | | 0 33 | | 0.4 | V |
| Input Leakage Current | ll | Vcc to GND | 0 | 5 5 | | | +0.1 | | +1 | | +1 | o:A |
| Quiescent Device Current | lcc | Vcc or GND | 0 | 5 5 | | | 8 | | 80 | | 160 | |
| Additional Quiescent Device Current Per Input Pin: 1 Unit Load (Note 4) | Clcc | Vcc -2.1 | | 4.5 to 5 5 | | 100 | 360 | | 450 | | 490 | |
| Three-State Leakage Current | 102 | VIL or VIH | | 5 5 | | | +0.5 | | ±5 | | +10 | |
| NOTE: 4. For dual-supply systems theoretical worst case (VI = 2.4V, Vcc = 5.5V) specification is l.8mA. HCT Input Loading Table |
| | INPUT | UNIT LOADS | |
| CD74HCT240 |
| nAO-A3 | 1.5 |
| 10E | 0.7 |
| 20E | 0.7 |
| CD74HCT241 |
| nAO-A3 | 0.7 |
| 10E | O7 |
| 20E | 1.5 |
| CD74HCT244 |
| nAO-A3 | 0.7 |
| 10E | 0.7 |
| 20E | 0.7 |
| NOTE: Unit Load is Clcc limit specified in DC Electrical Specifications table, e.g., 3600:A max at 250C. |
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SCR outputs for high dv/dt, current and voltage capability. Choice of AC or DC inputs. Choice of Zero Cross and Random Turn- On versions. Constant Current Input minimizes source current requirement (standard on D and A inputs only) Constructed using Teledyne's unique PowerthermTM process. This process yields superior thermal impedance and power cycling capabilities through reduced thermal interconnections, allowing for cooler, more reliable operation. The logic drive circuitry sections use the latest in reliable surface mount technology. Certifications:
