| Vb | | RL ^vr_ |
| |
| | uT | VDD ( 0.5 rated |
| | |
| | |
The power handling capability of the device will be limited by the maximum rated junction temperature (125IC). The device dissipation PD = IOUT(2VIN - VOUT) +VIN(2mA). The device dissipates the majority of its heat through its pins, especially GND (Pin 2). Thermal resistance to ambient can be optimized by connecting GND to a large copper region on the PCB, which serves as a heat sink. Applications that operatethe LTC1928-5 near maximum powerlevels should maximize the copper area at all pins except CP and CN/SHDN and ensure that there is some airflow over the part to carry away excess heat.