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suppliers of PB28F400B5T80 and PDF data of PB28F400B5T80

Part Numbert	Mfg	Packt	D/C	Descriptiont	Qty	Company/Contact
PB28F400B5T80	INTEL				1600	Shen Zhen FULEYA Technology CO.. Contact:Angel Tel:86-0755-82730755 Fax: Email: angelchaohui@163.com
PB28F400B5T80	INTEL	1600	SOP	SOP		AN NUOKE(HONGKONG) ELECTRONIC .. Contact:LING Tel:86-20-83339205 Fax:86-20-83339120 Email: annuoke@126.com
PB28F400B5T80	INTEL				1600	HY (HK) IC Limited Contact:Melody Tel:86-755-82535765 Fax:86-755-82535755 Email: melody_ic@tom.com
PB28F400B5T80	intel	soic			3650	usa ic inc Contact:Ella Tel:86-755-83778225 Fax: Email: Sales24@usa-ic.com
PB28F400B5T80	SOP		INTEL		04+	wrightway electronics limited Contact:alex Tel:86-755-89537661 Fax: Email: info@wrightway.cn

PB28F400B5T80 Datasheet

	MIN	TYF:	MAX	UN
DC Current Transfer Ratio (IF = lOmA, VCE = 10V) H11A5100 H11A550 H11A520 Saturation Voltage - Collector to Emltter (IF = 20mA, lc i- 2mA) Isolation Resfstance (Input to Output VoltaSe = 500VDC. See Note l) Input to Output Capacltance (Input to Output Voltage = O,f= 1 MHz. See Note l) Tum-On Tlme - ton (VCC = 10V, lC = 2mA, RL = 100S7,), (See Flgure l) Turn-Off Time - ton (Vcc - 10V, lc = 2mA, RL = 100fl). (See Figure l)	100 50 20 100	5 5	0.4 2O 10 10	L7 c/ c/ volts 8igaohms picofarads microseconds microseconds

PB28F400B5T80 Price

1.1 Scope. This specification covers the performance requirements for two electrically isolated, unmatched PNP silicon transistors as one dual unit for Hl-speed saturated switching applications. Three levels of product assurance are provided for each device type as specified in MIL-PRF-19500.
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Notes: 1. This condition is for AC function test only, not for AC parameter test. 2. To maintain a valid level, the transitioning edge of the input must : a) Sustain a constant slew rate from the current AC level through the target AC level, VL(AC} or VIH(AC} b) Reach at least the target AC level c) After the AC target level is reached, continue to maintain at least the target DC level, VIL(DC} or VIH(DC

(1) Bending a lead should avoid. However, when bending is necessary, take care the next items. Ol Bending a lead must be done before soldering. Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that stress for the regin part cause troubles such as gold wire breaking and so on. A lead must be bend under the stay. Do not bend the same position ofleads more than twice. (2) The hole pitch ofa circuit board must fit to the lead pitch. (3) Two stays coupling LED and Ph. Tr should be isolated from any PCB pattern or any lead. (4) Take core the following when soldering. Ol Do not heat a product under any stress (a twist and so on) to leads. Do not heat a product in the states of operating force to the regin part. (5) Use the flux which contain no chlorine, have no corrosion and do not need washing. (6) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.

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