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PB-5R0V104-R Datasheet
Expansion Port The Expansion Port allows up t0 6 NWK954s to be cascaded. This allows a 24-port hub to be built with no additional extemal components. The Expansion Port includes a 5-bit parallel bidirectionaldata bus (IRD)which carries unscrambled symboldata and a 25MHz sampling clock (BPCLK). Each NWK954 indicates receive activity on any of its 4 twisted pair ports by asserting the localactivity output (LACTOUT_N).The LACTOUT_N signals from each NWK954 connect to thelocalactivityinputs (LACTIN_N) of all the other cascaded NWK954s.
PB-5R0V104-R Price

PART TEMP.F ?ANGE PIN-PACKAGE
MAX202ECPE Ooc to +700C 16 Plastic DIP
MAX202ECSE OoC to +700C 16 Narrow SO
MAX202ECUE OoC to +700C 16 TSSOP
MAX202ECWE Ooc to +700C 16 Wide SO
MAX202EC/D OoC to +700C Dice*
MAX202EEPE -400C to +850C 16 Plastic DIP
MAX202EESE -400C to +850C 16 Narrow SO
MAX202EEUE -400C to +850C 16 TSSOP
MAX202EEWE -400C to +850C 16 Wide SO
MAX203ECPP OoC to +700C 20 Plastic DIP
MAX203ECWP OoC to +700C 20 SO
MAX203EEPP -400C to +850C 20 Plastic DIP
MAX203EEWP -400C to +850C 20 SO
MAX205ECPG OoC to +700C 24 Wide Plastic DIP
MAX205EEPG -400C to +850C 24 Wide Plastic DIP
MAX206ECNG OoC to +700C 24 Narrow Plastic DIP
MAX206ECWG OoC to +700C 24 SO
MAX206ECAG Ooc to +700C 24 SSOP
MAX206EENG -400C to +850C 24 Narrow Plastic DIP
MAX206EEWG -400C to +850C 24 SO
MAX206EEAG -400C to +850C 24 SSOP
MAX207ECNG OoC to +700C 24 Narrow Plastic DIP
MAX207ECWG OoC to +700C 24 SO
MAX207ECAG Ooc to +700C 24 SSOP
MAX207EENG -400C to +850C 24 Narrow Plastic DIP
MAX207EEWG -400C to +850C 24 SO
MAX207EEAG -400C to +850C 24 SSOP


PB-5R0V104-R on stock
NOTES: 1. Failures from Interim electrical test l and 2 are combined for determining PDA l. 2. Failures from subgroup l, 7, 9 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the failures from subgroup 7. 3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004. 4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005. 5. Data Package Contents: . Cover Sheet (lntersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quantity). . Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage. . GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test equipment, etc. Radiation Read and Record data on file at Intersil. . X-Ray report and film. Includes penetrometer measurements. . Screening, Electrical, and Group A attributes (Screening attributes begin after package seal). . Lot Serial Number Sheet (Good units serial number and lot number). . Variables Data (AlI Delta operations). Data is identified by serial number. Data header includes lot number and date of test. . The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed by an authorized Quality Representative.
7. A write occurs during the overlap of a low CS#, a low WE# and a low LB# or a low UB# (tWP). A write begins at the latest transition among CS# going low, WE# going low and LB# going low or UB# going low. A write ends at the earliest transition among CS# going high, WE# going high and LB# going high or UB# going high. 8. tcw is measured from the later of CS# going low to the end of write.