N10SP010M Datasheet| I I I I I I I II -VIN = 100mVp-p (20, 50) | | | | VIN = 50mVp-p (100) | | | | | | | | | | | | A | =+20n | | | | | | | | I | Av=+5 | | 0v | | | | | 7 | | | | | | Av=+ | oo\uv | L | | | | | | l | | | | | | | 1 | I l | | | | | | | | | | | | | |
N10SP010M Price| ' CHARACTERISTIC : . ' | SYMBOL | MIN | TYP | MAX | UNIT | TEST CONDITIONS ii | | Drain to Source On-state Resistance | ROSton) | | 0.28 | 0.37 | Q | VGs = -10 V, ID = -1.0 A | | Drain to Source On-state Resistance | RDS(on) | | 0.50 | 0.68 | Q | VGs = ~4 V, lo = -0.8 A | | Gate to Source Cutoff Voltage . | VGS(ofn | -1.0 | -1.5 | -2.0 | V | Vos = -10 V, ID = -1 mA | | Forward Transfer Admittance | Il | 1.0 | 1.8 | | S | VDS = -10 V, ID = -1.0 A | | Drain Leakage Current | loss | | | -10 | pA | VDS = -60 Vr VGS = O | | Gate to Source Leakage Current | IGSS | | | +10 | )uA | VGS =16 V, VDS = O | | Input Capacitance | Ciss | | 320 | | pF | VDS = -10 V | | Output Capacitance | Coss | | 220 | | pF | VGs = 0 | | Reverse Transfer Capacitance ' | Crss | | 75 | | pF | f=l MHz | | Turn-On Delay Time | tdtan) | | 5 | | ns | \kSton} = -10 v | | Rise Time | | | 15 | | ns | Voo = -30 V | | Turn-Off Delay Time | tdloff) | | 40 | | ns | lo = ~1.0 Ar RG = 10Q | | Fall Time | tf | | 25 | | S | RL = 30 Q | | Total Gate Charge | QG | | 12 | | nC | \ks = -io V | | Gate to Source Charge . | QGS | | 1 | | nC | lo = -2.0 A | | Gate to Drain Charge | QGD | | 5 | | nC | VOD = -48 V | | Body Diode Forward Voltage | VF | | 0.9 | | V | IF = 2.0 Ar Vcs = 0 | | ESD | VEso | | ±130 | | V | c = 200 pF, R = O, Single Pulse | | Reverse Recovery Time | trr | | 72 | | ns | IF = 2.0 A, VGs - o | | Reverse Recovery Charge | Clrr | | 30 | | nC | di/dt = 50 Nps | | | | | | | |
N10SP010M on stock| 4. High contact capacity type Schematic (Bottom view) - | | | | I | | | | | | | | 1 | | | | | | | | | | | | | 15 | | | 2 | | Jll95288I- l U 2z.u 866 | I 'r- 1 2-6.3+OOa | 0 | q | 2-9.5-o Oa 2b.b 2- 374 " | 2248 | | | | | | | | | 1 043 7 dia. hole | | | | | 4- 067 dia Inole Sealed by epoxy resin 8.4 | } | J1618 | | | | 661 1 Dimension: General tolerance | 7R Max. 1mm .039 inch: +0.1±004 | | J . .g2 | | | | | | | | | | | | | | |
temperature will exceed 1250C when over-temperature protection is active Continuous operation above the specified maximum operating junction temperature may impair device reliability. Note 6: Guaranteed but not tested. Note 7: Maximum recommended SYNC frequency = 500kHz. Note 8: In applications where the VIN pin is supplied via an external RC network from a SYSTEM VIN > 25V, an external zener with clamp voltage VIN ON(MAX) < VZ < 25V should be connected from the VIN pin to ground. Note 9: VIN start-up current is measured at VIN = VIN ON - 0.25V and scaled by x l.1 8 (to correlate to worst case VIN start-up current at VIN ON) Note 10: Timing for R = 40k derived from measurement with R = 240k.
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