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N01095.0500200020 Datasheet

Parameter		Symbol	Rating	Unit
Input	Forward current	lF	50	mA
	Pazak fnrward currant (1[lflus)		1	A
	Reverse voltage	VR	6	v
	Power dissipation	PD	70	mW
Output	Off-State Output Terminal voltage	VDRM	600	Vpeak
	On-State R. M. S. Current	IT(RMS)	100	mA
	Peak Repetitive Surget Current (PW=lOms, DC 10%)	ITSM	1	A
	Power dissioation	PD	300	mW
Total power dissipation		Ptot	330	mW
lsalation voltage l minute		Viso	5000	Vrms
Operating temperature		Topr	·40 to +85	oc
Storage temperature		Tstg	-50 to +125	oc
Soldering lemparatura 10 second		Tsol	260	oc

N01095.0500200020 Price

1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35rmn (#80 / .0135") diameter drill and have a final plated thru diameter of.25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use l oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
N01095.0500200020 on stock

l Rev. N	Revision Note	Date	Signature
l B	1998 Catalogue Page 52	1-1-98	RG

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