| | | - CC(DDR400@CL=3) | - C4(DDR400CL=3) | | |
| Parameter | Symbol | Min | Max | Min | Max | Unit | Note |
| Row cycle time | tRC | 55 | | 60 | | ns | |
| Refresh row cycle time | tRFC | 70 | | 70 | | ns | |
| Row active time | tRAS | 40 | 70K | 40 | 70K | ns | |
| RAS to CAS delay | tRCD | 15 | | 18 | | ns | |
| Row precharge time | tRP | 15 | | 18 | | ns | |
| Row active to Row active delay | tRRD | 10 | | 10 | | ns | |
| Write recovery time | tWR | 15 | | 15 | | ns | |
| Internal write to read command delay | tWTR | 2 | | 2 | | tCK | |
| | CL=3.0 | | 5 | 10 | 5 | 10 | ns | |
| Clock cycle time | CL=2.5 | tCK | 6 | 12 | 6 | 12 | ns | 16 |
| Clock high level width | tCH | 0 45 | 0 55 | 0 45 | 0 55 | tCK | |
| Clock low level width | tCL | 0 45 | 0 55 | 0 45 | 0.55 | tCK | |
| DQS-out access time from CK/CK | tDQSCK | -0.55 | +0.55 | -0.55 | +0.55 | ns | |
| Output data access time from CK/CK | tAC | -0.65 | +0.65 | -0.65 | +0.65 | ns | |
| Data strobe edge to ouput data edge | tDQSQ | | 0 4 | | 0.4 | ns | 13 |
| Read Preamble | tRPRE | 0 9 | 1.1 | 0.9 | 1.1 | tCK | |
| Read Postamble | tRPST | 0 4 | 0 6 | 0 4 | 0.6 | tCK | |
| CK to valid DQS-in | tDQSS | 0.72 | 1.28 | 0.72 | 1.28 | tCK | |
| Write preamble setup time | tWPRES | 0 | | 0 | | ps | 5 |
| Write preamble | tWPRE | 0.25 | | 0 25 | | tCK | |
| Write postamble | tWPST | 0.4 | 0.6 | 0.4 | 0.6 | tCK | 4 |
| DQS falling edge to CK rising-setup time | tDSS | 0.2 | | 0.2 | | tCK | |
| DQS falling edge from CK rising-hold time | tDSH | 0 2 | | 0.2 | | tCK | |
| DQS-in high level width | tDQSH | 0.35 | | 0 35 | | tCK | |
| DQS-in low level width | tDQSL | 0 35 | | 0 35 | | tCK | |
| Address and Control Input setup time | tIS | 0 6 | | 0 6 | | ns | h,710 |
| Address and Control Input hold time | tIH | 0.6 | | 0.6 | | ns | h,710 |
| Data-out high impedence time from CK/CK | tHZ | | tAC max | | tAC max | ns | 3 |
| Data-out low impedence time from CK/CK | tLZ | tAC min | tAC max | tAC min | tAC max | ns | 3 |
| Mode register set cycle time | tMRD | 2 | | 2 | | tCK | |
| DQ & DM setup time to DQS, slew rate 0.5V/ns | tDS | 0 4 | | 0 4 | | ns | ij |
| DQ & DM hold time to DQS, slew rate 0.5V/ns | tDH | 0.4 | | 0 4 | | ns | ij |
| DQ & DM input pulse width | tDIPW | 1 75 | | 1 75 | | ns | 9 |
| Control & Address input pulse width for each input | tIPW | 2 2 | | 2 2 | | ns | 9 |
| Refresh interval time | tREFI | | 7.8 | | 7.8 | us | 6 |
| Output DQS valid window | tQH | tHP -tQHS | | tHP -tQHS | | ns | 12 |
| Clock half period | tHP | mi¨n tCH/tCL | | mi¨n tCH/tCL | | ns | 11 12 |
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Five different grades are available. The J and K grades are specified for operation over the OoC t0 700C temperature range. The A and B grades are specified from -400C to +850C, the T grade is specified from -550C to +1250C. The J and K grades are available in a 28-lead plastic DIP or 28-lead SOIC. All other grades are available in a 28-lead hermetically sealed ceramic DIP.
MZ-141-K on stock| Symbol | Parameter | Value | Unit |
| Vcc+ | Supply Voltage - (note l) | 18 | V |
| Vid | Differential Input Voltage - (note 2) | ±18 | V |
| Vi | Input Voltage - (note 3) | 18 | V |
| VO | Output Voltage | 18 | V |
| lo | Output Current | 20 | mA |
| Toper | Operating Free-Air Temperature Range TS3702C TS37021 TS3702M | 0 to +70 -40 to +125 -55 to +125 | oC |
| Tstg | Storage Temperature Range | -65 to +150 | oC |
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| P | N | | |
| MAX6453 MAX6454 | MAX6455 MAX6456 | NAME | FUNCTION |
| 1 | | | Active-Low Push-Pull or Open-Drain Output. RESET changes from high to low when VCC or RSTIN drops below its selected reset threshold. RESET remains low for the 140ms (min) reset timeout period after all monitored power-supply inputs exceed their selected reset thresholds. MR does not affect RESET output. For open-drain outputs, connect to an external pullup resistor. |
| | 1 | RESET | Active-Low Push-Pull or Open-Drain Output. RESET changes from high to low when VCC or RSTIN drops below its selected reset threshold. RESET remains low for the 140ms (min) reset timeout period after all monitored power-supply inputs exceed their selected reset thresholds. RESET changes from high to low after MR input is held low for the 3.36s (typ) setup period and deasserts 140ms (min) after MR deasserts. For open-drain outputs, connect to an external pullup resistor. |
| 2 | 2 | GND | Ground |
| 3 | 3 | MROUT | Manual Reset Push-Pull or Open-Drain Output. MROUT asserts immediately after MR is pulled low. MROUT remains low for 140ms (min) after MR is deasserted. For open- drain outputs, connect to an external pullup resistor. |
| 4 | 4 | vcc | VCC Voltage Input. Power supply and input for the primary microprocessor voltage reset monitor. |
| 5 | 5 | RSTIN | Reset Input. High-impedance input to the adjustable reset comparator. Connect RSTIN to the center point of an external resistor divider to set the threshold of the externally monitored voltage. |
| 6 | | | Manual Reset Input. Internal 50kQ pullup to VCc. Pull MR low to immediately assert MROUT. MR does not affect RESET output. |
| | 6 | MR | Manual Reset Input. Internal 50kQ pullup to VCC. Pull MR low to immediately assert MROUT. RESET changes from high to low after MR input is held low for the 3.36s (typ) setup period. |
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