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MXS00370SLB0 Datasheet Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may ap- pear in this material. MXS00370SLB0 Price Wrlting Data To The FIFO The HIGH state of the Full Flag (FF) indicates that Lhe FIFO is capable of accepting data. The falling edge of Write (W) initiates a write cycle. (See Figure 3.) Data appearing at inputs DO-D8 tDS prior to and tDH after the rising edge of W will be stored sequentially in the FIFO. The LOW- to-HIGH transition of the Empty Flag (EF) occurs tWEF after the rising edge of W during the first write cycle on an empty FIFO. (See Figure 4.) The Half-Full Flag (HF) will go LOW tWHF after the falling edge of W during the write operation which creates the half-full condition. (See Figure 5.) HF will remain LOW, while the number of writes to the FIFO exceeds the number of reads by 512 0r more. The Half-Full Flag is not available in Depth-Expan- sion Mode. The Full Flag (FF) goes LOW tWFF after the falling edge of W during the write cycle which creates a full condition. (See Fig ure 6.) A full condition exists when there have been 1 024 more write cycles than read cycles. The Full Flag being active prohibits any further write operations, thus preventing data overflow situ- ations. MXS00370SLB0 on stock The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. O The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. |
