MI-PC6KK-MW Datasheet| | | | LIMITS | | | SYMBOL | PARAMETER | WAVEFORM | Vcc = 3.3V +0.3V | vcc= 2.7V | vcc= 1.2V | UNIT | | MIN | TYPi | MAX | MIN | MAX | TYP | | tPHL tPLH | Propagation delay CP to Qn | 1 | | 4.9 | 8.0 | | 9 0 | 24 | ns | | tPHL tPLH | Propagation delay CP to TC | 1 | | 517 | 9.5 | | 11 | 28 | ns | | tPHL tPLH | Propagation delay CET to TC | 2 | | 4.5 | 7.8 | | 8 8 | 19 | ns | | tw | Clock pulse width HIGH or LOW | 1 | 4.0 | 1.2 | | 5 0 | | | ns | | tsu | Set-up time Dn to CP | 3 4 | 2.5 | 1.0 | | 3 0 | | | ns | | tsu | Set-up time MR, PE to CP | 4 | 3.0 | 1.2 | | 3 5 | | | ns | | tsu | Set-up time CEP, CET to CP | 5 | 5.0 | 2.1 | | 5 5 | | | ns | | th | Hold time Dn, PE, CEP, CET, MR to CP | 3 4 and 5 | 0 | -1.7 | | O | | | ns | | fmax | Maximum clock pulse frequency | 1 | 125 | 200 | | 110 | | | MHz | | | | | | | | | | | MI-PC6KK-MW Price| | | | | | | J 7Jr | | | | | | | | | | | | _ | l | | | | | | | | | | | | | | r | | | | | | | | | | | | 7 | i | I | | | | | | | | | | | | | j r II JI' I | r | | ' 0.2 0.1 | | | | | | | | | | r | | | | - 0.05 | | | | | | | | | r | | | | | 0.02 | | | | | | | | | | | | | | . 0.01 | | | | | | | | f | | | | | 0C 0 | l( | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | MI-PC6KK-MW on stock| | | | | | | | | | | | | | | Burst Mode OPERATIOP | | | | | | | | | | | | | | PU | LSE SK | PPING | ~ODE | | | | | | | | | | | | | | |
DESCRIPTION The Max220 rM package is a new high volume power package exibiting the same footprint as the industry standard T0-220, but designed to accomodate much larger silicon chips, normally supplied in bigger packages. The increased die capacity makes the device ideal to reduce component count in multiple paralleled T0-220 designs and save board space with respect to larger packages. |