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Part Numbert Mfg Packt D/C Descriptiont Qty Company/Contact  

MI-PC6KK-MW Datasheet

LIMITS
SYMBOL PARAMETER WAVEFORM Vcc = 3.3V +0.3V vcc= 2.7V vcc= 1.2V UNIT
MIN TYPi MAX MIN MAX TYP
tPHL tPLH Propagation delay CP to Qn 1 4.9 8.0 9 0 24 ns
tPHL tPLH Propagation delay CP to TC 1 517 9.5 11 28 ns
tPHL tPLH Propagation delay CET to TC 2 4.5 7.8 8 8 19 ns
tw Clock pulse width HIGH or LOW 1 4.0 1.2 5 0 ns
tsu Set-up time Dn to CP 3 4 2.5 1.0 3 0 ns
tsu Set-up time MR, PE to CP 4 3.0 1.2 3 5 ns
tsu Set-up time CEP, CET to CP 5 5.0 2.1 5 5 ns
th Hold time Dn, PE, CEP, CET, MR to CP 3 4 and 5 0 -1.7 O ns
fmax Maximum clock pulse frequency 1 125 200 110 MHz


MI-PC6KK-MW Price

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MI-PC6KK-MW on stock

Burst Mode OPERATIOP
PU LSE SK PPING ~ODE


DESCRIPTION The Max220 rM package is a new high volume power package exibiting the same footprint as the industry standard T0-220, but designed to accomodate much larger silicon chips, normally supplied in bigger packages. The increased die capacity makes the device ideal to reduce component count in multiple paralleled T0-220 designs and save board space with respect to larger packages.