| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| JM38510-76207BEA | UNI/TI | DIP-16 | 08+09+ | stock | 678 |
|
|
| JM38510-76207BEA | UNI/TI | DIP-16 | 03+ | New original packing | 1192 |
|
|
JM38510-76207BEA Datasheet 1. IOL(R/B) of l.8V device is changed. -min. Value: 7mA -->3mA -typ. Value: 8mA -->4mA 2. Package part number is modified. K9F6408UOC-Y ---> K9F6408UOC T 3. AC parameter is changed. tRP(min.) : 30ns --> 25ns 1. TBGA package is changed. - 9mmX11mm 63ball TBGA ---> 6mmX8.5mm 48ball TBGA 2. Part number(TBGA package part number) is changed - K9F6408QOC-D ----> K9F6408QOC-B - K9F6408UOC-D -----> K9F6408UOC-B 3. K9F6408UOC-BCBO,BIBO products are added JM38510-76207BEA Price 184 edge connector pads with lmm pad spacing 512 MB Direct RDRAM storage Each RDRAM' has 32 banks. for 512 banks total on module Gold plated contacts RDRAMs use Chip Scale Package (CSP) Serial Presence Detect support Operates from a 2.5 V supply Powerdown self refresh modes Separate Row and Column buses for higher efficiency Over Drive Factor (ODF) support JM38510-76207BEA on stock
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
