IS61LV5128-15KLI Datasheet Evaluation Board Layout Board Size 2.0" x 2.0" Board Thickness 0.028", Board Material FR-4, Multi-Layer Ground Plane at 0.014" IS61LV5128-15KLI Price| Symbol | Parameter | CondItIons | RatIng | Unlt | | Vcc | Supply Voltage | Relative to GND | - 0.6 to +7O | V | | Vlo | Voltage Applied to All Pins Except A9.VPP | Relative to GND | -0.6 to Vcc+0.6 | V | | V102 | Voltage Applied to A9 and VPP | Relative to GND | -0.6 to +13.5 | V | | | Ambient Temp., Power Applied | | -65 to +150 | 'C | | TST | Storage Temperature | | -65 10 +150 | 'C | | TLT | Lead Temperature | Soldering 10 seconds | +300 | 'c | | | | | |
| Drain- source breakdown voltage VGS = 0 V, /D = 0.25 mA, Tj = 25 aC | V(BR)DSS | 400 | | | V | | Gate threshold voltage VGS= VDS, /D = 1 mA | VGS(th) | 2.1 | 3 | 4 | | Zero gate voltage drain current VDS = 400 V, VGS = 0 V, Tj = 25 aC VDS = 400 V, VGS = 0 V, Tj = 125 aC | /DSS | | 0.1 1 0 | 1 1 00 | UA | | Gate-source leakage current VGS = 20 V, VDS = OV | /GSS | | 1 0 | 1 00 | nA | | Drain-Source on-resistance VGS = 10 V, /D = 6.5 A | RDS(on) | | 0.35 | 0.5 | 1 | | | | | | |
Electrostatic damage (ESD) has been well recognized for MOSFET devices, but any semiconductor device deserves protection from this potentially damaging source. The VCA610 incorporates on-chip ESD protection diodes as shown in Figure 4. This eliminates the need for the user to add external protection diodes, which can add capacitance and degrade AC performance.
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