| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| AD7528KRZ | AD | SOP | 06+ | 21 |
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| AD7528KRZ | AD | SOP |
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| AD7528KRZ | AD | 9500 |
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| AD7528KRZ | AD | 5000 |
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| AD7528KRZ | AD | N/A | 9+ | New & original, stoc | 20000 |
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| AD7528KRZ | AD | SOP | 07+ | 2200 |
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| AD7528KRZ | AD | 02+ | SOP |
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| AD7528KRZ | AD | 5000 |
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| AD7528KRZ | AD | 09+ | 10000 |
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| AD7528KRZ | AD | SOP | 5000 |
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| AD7528KRZ | AD | 07+ | 2200 |
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| AD7528KRZ | AD | SOP | 5000 |
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| AD7528KRZ | AD | SOP | 5000 |
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| AD7528KRZ | AD | 5000 |
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| AD7528KRZ | SOP | 5000 | in stock | AD |
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AD7528KRZ Datasheet The MCF5249 DRAM controller provides a glueless interface for up to two banks ofDRAM, each ofwhich can be up t0 32 Mbytes. The controller supports a 16-bit data bus. A unique addressing scheme allows for increases in system memory size without rerouting address lines and rewiring boards. The controller operates in page mode, non-page mode, and burst-page mode and supports SDRAMs. AD7528KRZ Price Mounting: Heat sink flatness must be less than 50 pm (a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resistance and to reduce the bending stress on the ceramic substrate caused by the temperature difference to the heat sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 t0 0.6 Nm.
Hitachi Asia (Hong Kong) Ltd. Group lIl (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon, Hong Kong Tel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281 URL : http://www.hitachi.com.hk |
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