| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| AD5624RBRMZ-3 | AD | 12bit Quad | 2010+ | RM |
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| AD5624RBRMZ-3 | AD | 10-MSOP，Mi | 08+ | 专营AD系列#%现货库存热卖中 | 1134 |
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| AD5624RBRMZ-3 | ADI | new in ori | 0923+ | New & original, stoc | 50 |
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| AD5624RBRMZ-3 | ADI | 10-MSOP, M | 08+ | 1,355 |
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| AD5624RBRMZ-3 | ADI | Welcome Fo | 08+ | New original U.S. ma | 2650 |
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| AD5624RBRMZ-3 | ADI | MSOP10 | 2008+ | 15000 |
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| AD5624RBRMZ-3 | ADI | MSOP10 | 2008+ | 15000 |
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| AD5624RBRMZ-3 | AD | new | wendy9258@hotmail.co | 500 |
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| AD5624RBRMZ-3 | ADI | 07+ | 450 |
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AD5624RBRMZ-3 Datasheet
AD5624RBRMZ-3 Price Multiplying Circuit Offset Adjust 10K i R5 = Rg = R16 < 50K R7 = Rll = R14, = 100Q R6 = R10 = 100Q (VS/0.05) Ris = 100Q (Vs/0.10) R8 = Rl IIRa R12 = R2 IIRb R13 =RoIIRcIIRcxIIRCY AD5624RBRMZ-3 on stock where f = operating frequency, COUT = output capacitance and IL = ripple current in the inductor. For a fixed output voltage, the output ripple is highest at maximum input voltage since IL increases with input voltage. 2. Unless otherwise specified, a minimum clearance of .015 inch (0.38mm) shall be maintained between all metallized features (e.g., lid, castellations, terminals, thermal pads, etc.). 3. Dimension "A" controls the overall package thickness. The maximum "A" dimension is the package height before being solder dipped. The corner shape (square, notch, radius, etc.) may vary at the manufacturer's option, from that shown on the drawing. The index corner shall be clearly unique. 5. Dimension "B3" minimum and "L3" minimum and the appropriately derived castellation length define an unobstructed three dimensional space traversing all of the ceramic layers in which a castellation was designed. Dimension "B3" maximum and "L3" maximum define the maximum width and depth of the castellation at any point on its surface. Measurement of these dimensions may be made prior to solder dripping. 6. Chip carriers shall be constructed of a minimum of two ceramic layers
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