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508271031 Datasheet

Parameter Symbol Conditions min typ max Unit
Drain to Source cut-off current IDSS* VDS = 4.5V, Vcs = 0, Rs = 2.2kQ + lole 0 04 0.8 mA
Mutual conductance gm VDS = 4.5V, Vcs = 0 Rs = 2.2kQ + 1%, f = lkHz 300 500 ¨s
Noise figure NV VDS = 4.5V, Rs = 2.2kQ + 1% Cc = lOpF, A-curve 4 IIV
Gvi* VDS = 4.5V, Rs = 2.2kQ + 1% Cc = lOpF, ec = lOOmV, f = 70Hz -10 dB
Voltage gain GV2* VDS = 12V, Rs = 2.2kQ + lclo Cc = lOpF, ec = lOOmV, f = 70Hz -9.5 dB
GV3* VDS = 1V, Rs = 2.2kQ + 1% Cc = lOpF, ec = lOOmV, f = 70Hz -11 dB


508271031 Price
Low-impedance, metal-to-metal, ViaLink interconnect technology provides nonvolatile custom logic capable of operating above 150 MHz. Logic cell delays under 2 ns, combined with input delays of under l.5 ns and output delays under 3 ns, permit high-density programmable devices to be used with today's fastest microprocessors and DSPs.
508271031 on stock
res.rbreak n17 n18 = 1, tcl = 1.05e-3, tc2 = -9e-7 res.rdrain n50 n16 = 9e-4, tcl = 1.9e-2, tc2 = 4e-5 res.rgate n9 n20 = 1.36 res.rldrain n2 n5 = 10 res.rlgate nl n9 = 48.1 CA res.rlsource n3 n7 = 46.3 res.rslcl n5 n51= 1e-6, tcl = 1e-3, tc2 =1e-5 res.rslc2 n5 n50 = 1e3 res.rsource n8 n7 = 2.3e-3, tcl = 1e-3, tc2 =1e-6 res.rvtemp n18 n19 = 1, tcl = -2.4e-3, tc2 = 1e-6 res.rvthres n22 n8 = 1. tcl = -6e-3. tc2 = -1.9e-5
Microchip received OS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company's quality system processes and procedures are OS-9000 compliant for its PICmicro~ 8-bit MCUs, KEELOO~ code hopping devices, Serial EEPROMs and microperipheral products. In addition, Microchip's quality system for the design and manufacture of development systems is IS0 9001 certified.