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suppliers of 1025R-32J and PDF data of 1025R-32J

Part Numbert	Mfg	Packt	D/C	Descriptiont	Qty	Company/Contact
1025R-32J	Delevan		2008+	Delevan A full rang	500	SEA SOURCE(HONGKONG)CO.,LTD Contact:yan Tel:86-755-83255925 Fax: Email: SEASOURCE@VIP.163.COM
1025R-32J	Delevan		08+	L/T=6-8 Weeks	500	GuangZhou BinBin Technology De.. Contact:lin Tel:86-20-31795262 Fax: Email: gzbbdz@qq.com
1025R-32J	Delevan		08+		500	HK CHISHING ELECTRONICS CO., Contact:maggielee Tel:86-755-61303995 Fax:86-755-61306028 Email: maggielee@zcicgs.com.cn

1025R-32J Datasheet

The PP pin function is blocked when the PPEN bit in the status registeris "0".This allows the userto install the X25F064/032/016/008 into a system with PP pin grounded and still be able to program the status register. The PP pin functions will be enabled when the PPEN bit is set "0".
1025R-32J Price

ANG -11.3 -21.9 -32.2 -41.3 -50.5 -58.3 -65.5 -71.6 -77.5 -83.8 -88.8 -93.5 -98.5 -103.2 -107.8 -112.9 -118.7 -124.5 -131.2 -138.7 -146.3 -154.2 -162.6 -169.5 -175.9 178.6 174.0 170.2 166.7 163.8
1025R-32J on stock

The REG104 has very low output noise (typically 33ccVrms for VOUT = 3.3V with CNR = O.OlccF), making it ideal for use in portable communications equipment. On-chip trimming results in high output voltage accuracy. Accuracy is main- tained over temperature, line, and load variations. Key parameters are tested over the specified temperature range (-40IC to +85IC).

The ROM Micro Size DC/DC-Converter has been designed for isolating resp. converting DC Power Rails It provides a small micro-size package, high efficiency, low output ripple, high 3kVDC Isolation and an extended -400C to +850C operating temperature range. State of the art packaging and automated manufacturing ensures cost-effectiveness and short lead times

Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for heat flow. Proper mounting ensures the best thermal flow from this area of the package to the heat sink. Linear Technology strongly recommends thermal compound at the case-to-heat sink interface. Use a thermally conductive spacer if the case of the device must be electrically isolated and include its contribution to the totalthermal resistance. Please consult "Mounting Considerations for Power Semiconductors" 1990 Linear Applications Handbook, Volume /, Pages RR3-1 to RR3-20. The output connects to the case of the device in the LT1587-1.5.

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